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3D Solder Paste Inspection System

VP-5200

OMRON VP-5200 V

The VP5200-V uses a highly accurate and repeatable, true 3D image acquisitions using Phase shift technology to perform complete PCB solder paste analysis. Potential PCB warpage is calculated at each inspection area and the camera will auto-focus to compensate prior to analysis. These features combine to achieve precise volume measurements at accuracy within three percent.

VP6000

OMRON VP- 6000 V

The new VP6000-V can complete the loop 3D inspection of solder paste with the opportunity to correct the excesses of your screen printing process. The unique Phase shift technology combined with twin projector for the acquisition and measurement of screen printed volume guarantees reliability and repeatability of high quality.

Z-CHECK-100

Z-CHECK 100

This offer Non-contact solder paste precision measuring. Z-Check 100 is Entry level non-contact SPI system that can be quickly installed with minimal disruption.
Major features incorporated are manual Friction Free Glide stage, Automatic Z-axis measurement, 3 axis measurement and volume.
Capable of Controlling 10 production lines with unlimited data streams

Z-CHECK

Z-CHECK 600

Consists of a Maglok table which is an X-Y glide stage with electro magnets that lock the X and/or Y axis individually.
Major Features includes White light source, Pad specific measurement, Automatic Z-axis focus and 3 axis measurement and volume