Yamaha S10 / S20
The Yamaha S10 and S20 are cutting-edge modular placement systems engineered to meet the future demands of 3D MID (Molded Interconnect Device) manufacturing. Built for flexibility, precision, and scalability, they enable placement not only on flat PCBs but also on curved, tilted, and complex surfaces—expanding the boundaries of SMT production.
Overview
Designed to support next-generation 3D MID applications, the Yamaha S10 and S20 platforms deliver ultimate placement flexibility across a range of industries including automotive, medical, and telecommunications. These systems are structured to handle concave, convex, and angled surfaces, making them ideal for advanced circuit integration in molded plastics. With high-speed performance, broad component compatibility, and a user-friendly setup, the S10/S20 platforms are fully equipped to tackle the evolving landscape of modular and 3D electronics assembly.
Features
- 3D MID Capability: Supports dispense and placement on curved, concave, convex, and tilted surfaces.
- Large Board Support: Accommodates oversized boards for complex applications.
- Wide Component Range: Handles components from 0201 chips up to 120 mm × 90 mm, including BGA, CSP, connectors, and odd-shaped parts.
- High Feeder Capacity: Designed for efficient material handling and minimal downtime.
- Flexible & Scalable: Modular design enables quick setup, easy reconfiguration, and future expansion.
- Ultra-Fast Placement Speed: Delivers placement speeds up to 45,000 CPH.
- Precision Placement: Engineered for fine-pitch accuracy with tight tolerances.
- Built for the Future: Machine structure is pre-arranged to support upcoming 3D MID industry demands.
Specifications
- Model: Yamaha S10 / S20
- Application Focus: 3D MID – Molded Interconnect Device assembly
- Surface Handling: Supports standard PCBs, as well as curved, concave, convex, and tilted surfaces
- Component Range: 0201 chips to 120 mm × 90 mm components (BGA, CSP, connectors, odd-shaped parts)
- Placement Speed: Up to 45,000 components per hour (CPH)
- Placement Accuracy A (Chip): ±0.040 mm (40 μm @ μ+3σ)
- Placement Accuracy B (IC): ±0.025 mm (25 μm @ μ+3σ)
- Feeder Capacity: High-capacity configuration for flexible material management
- Industry Use: Automotive, medical, telecommunications, and advanced 3D electronic applications