ITW – CAMALOT PRODIGY - Edge/Corner Bonding
The Camalot® Prodigy delivers high-precision adhesive dispensing for edge and corner bonding applications. Engineered for control and repeatability, its advanced dispense technology ensures reliable bonding performance to strengthen chip-scale packages (CSPs) and BGAs during mechanical stress and drop testing.
Overview
Camalot® precision dispense systems support edge and corner bonding as an effective alternative to underfill. This process adds mechanical strength to BGA and CSP components and improves overall reliability, especially in drop testing environments. Dispensed post-reflow, the adhesive is later cured in an oven. Camalot machines provide the control needed to wet only the edge of the component, minimizing unwanted flow beneath and ensuring accurate placement for consistent results.
Features
- Precision adhesive dispensing for corner/edge bonding
- Increases mechanical strength and drop-test reliability for BGAs and CSPs
- Post-reflow dispense with oven curing process
- Prevents adhesive flow under components with controlled edge wetting
- Delivers high repeatability and consistent results
Specifications
- Equipment Type: Corner/Edge Bonding Dispense System
- Model: Camalot® Prodigy
- Application: BGAs, CSPs, chip-scale packages
- Process Type: Post-reflow adhesive dispense
- Curing: Oven-based post-dispense curing
- Dispensing Focus: Wetting at component edge while avoiding underflow
- Key Feature: High-precision dispense control