ITW – CAMALOT PRODIGY - Underfill
The Camalot® Prodigy is designed for fast, accurate, and repeatable underfill dispensing across a wide range of packages and board-level assemblies. Equipped with Smart Stream® pump technology, it ensures complete and consistent underfill performance for flip chips, BGAs, stacked die packages, and more.
Overview
Underfill plays a critical role in enhancing the mechanical strength and thermal reliability of electronic assemblies. The Camalot Prodigy uses advanced Smart Stream® pump technology to dispense and flow underfill under flip chips, direct chip attach on boards, stacked die packages, and various BGA components. Once cured, the underfill stabilizes components and improves overall assembly reliability.
Features
- Reliable underfill dispensing for a wide variety of package types
- Fast and efficient application using Smart Stream® pump technology
- Compatible with flip chips, direct chip attach, BGAs, and stacked die packages
- Ensures complete underfill coverage for improved mechanical stability
- Repeatable, high-precision performance
Specifications
- Equipment Type: Underfill Dispense System
- Model: Camalot® Prodigy
- Dispensing Technology: Smart Stream® pump
- Supported Components: Flip chips, BGAs, stacked die, direct chip attach
- Function: Dispenses and flows underfill under components
- Result: Stabilizes and secures components after curing
- Application: Board-level assembly and semiconductor packaging