LEAPTECH PCB CLEANER
Advanced Surface Cleaning for High-Yield SMT Production The LEAPTECH PCB CLEANER is engineered to remove glass fiber, dust particles, and other contaminants from the top surface of PCBs prior to solder paste printing, enhancing overall production yield. It is especially effective for PCBs assembled with extremely small components.
Overview
This system features PLC program control and supports online automatic cleaning, capable of removing all types of dust. An adhesive cleaning roll captures contaminants effectively, while an ionizer eliminates static electricity from the PCB surface. The draw-out design allows for easy replacement of adhesive rolls, and the unit provides preset PCB counts with pre-warning alerts for roll replacement.
Features
- Efficient Surface Cleaning: Removes glass fiber, dust, and particles from PCBs.
- Production Yield Improvement: Critical for fine-pitch and small component assembly.
- PLC Program Control: Automated cleaning for on-line production.
- Comprehensive Dust Removal: Suitable for all types of dust.
- Adhesive Cleaning Roll: Effectively captures particles, with easy roll replacement via draw-out design.
- Ionizer: Removes electrostatic charges from PCB surfaces.
- Maintenance Alerts:
- Preset PCB count.
- Pre-warning counter for adhesive roll purging.
- Automatic Width Adjustment: Ensures compatibility with various PCB sizes.
- SMEMA Compatible: Seamless integration with SMT lines.
Specifications
- Control System: PLC program control
- Cleaning Method: Adhesive cleaning roll + ionizer
- Features:
- Online automatic cleaning
- Draw-out design for adhesive roll replacement
- Pre-warning counter for roll purging
- Width Adjustment: Automatic
- Static Control: Integrated ionizer
- Compatibility: SMEMA standard