MAGICRAY 3D Semiconductor Bonding AOI
The MAGICRAY SW6000 Wire Bonding AOI system applies 3D structured light technology for advanced third-order optical inspection of semiconductors and lead wires (2 mil and above). It ensures precise and efficient detection in post-wire bonding processes while supporting rapid programming and robust data handling.
Overview
The SW6000 is specifically designed for semiconductor bonding quality assurance. It delivers highly accurate 3D inspection for wire bonding defects, ensuring production reliability in semiconductor assembly. With integrated functionalities such as defect annotation, data storage, and rapid program creation, the system enhances inspection efficiency while reducing downtime.
Features
- 3D Structured Light Technology: Enables precise third-order optical inspection
- High Accuracy: Detects defects on lead wires ≥ 2 mil
- Post-Wire Bonding Defect Testing: Ensures fast and reliable quality verification
- Rapid Programming: Quick setup for efficient production integration
- Defect Annotation & Data Storage: Supports documentation, traceability, and process control
- Precision Inspection: Designed for semiconductor assembly with high reliability requirements
Specifications
- System Type: 3D Semiconductor Wire Bonding AOI
- Model: SW6000
- Inspection Target: Semiconductors and lead wires (2 mil and above)
- Technology: 3D structured light, third-order optical inspection
- Functions: Post-wire bonding defect detection, defect annotation, data storage
- Application Use: Semiconductor bonding and wire inspection