MAGICRAY 3D SPI ICON Series
The MAGICRAY ICON Series is designed for 3D solder paste inspection (SPI) after SMT screen printing. With advanced optical technology and intelligent algorithms, it ensures highly accurate inspection results, even in challenging PCB conditions.
Overview
Equipped with Intelligent Zero Reference Point Technology, the ICON Series guarantees precise measurement accuracy, especially in cases of PCB board deformation. By combining 3D imaging with color-featured algorithms, the system provides robust detection of common solder paste defects and ensures reliable inspection for modern SMT production lines.
Features
- 3D Solder Paste Inspection: Tailored for post-SMT screen printing processes
- Intelligent Zero Reference Point: Delivers accurate measurements even with PCB warpage or deformation
- 3D + Color Algorithms: Enhances defect detection capability for improved reliability
- Comprehensive Defect Coverage: Detects solder bridging, solder breakage, icicles, and more
- High Accuracy: Ensures consistent and repeatable inspection performance
Specifications
- System Type: 3D Solder Paste Inspection (SPI)
- Series: MAGICRAY ICON
- Inspection Technology: 3D optical imaging with color-featured algorithms
- Applications: Post-SMT screen printing solder paste inspection
- Defect Detection: Solder bridging, solder breakage, icicle formation, and related defects
- Special Technology: Intelligent Zero Reference Point for precise measurement under PCB deformation