YAMAHA – YSB 55W (High-Speed & High-Accuracy Flip Chip Bonder)
- High bonding accuracy and x3 productivity of conventional machines.This brings a New Era in Semiconductor packaging for the expanding flip chip market.
- High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH.
- High-Accuracy ±5μm (3σ) & High-Quality & Flexibility.
- Our in-house developed MACS (Multiple Accuracy Compensation System) has been upgraded and now achieves bonding accuracy ±5μm (3σ). Original heat analysis & heat compensating algorithm realizes consistent placement accuracy.
- Wafer feeder with wafer expander & theta alignment mechanism as standard feature.
- Meticulous structural analysis and test verification achieve both high-level accel-decel drive and high-precision.