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Semiconductor Printers

ITW MPM Semiconductor Edison II ACT

ITW MPM – Semiconductor Assembly solution - Edison II ACT

  • Innovative machine design achieves ultra-tight coplanarity between stencil and substrate enabling yield improvement for ultra-thin stencil printing.
  • Designed to enable precise board alignment and board stretch compensation.
  • High precision load-cell with motor driven closed loop control ensures print force accuracy and consistence across the complete print stroke.
  • Edison II ±8 micron and the Momentum II ±11 micron machine alignment at ≥2 Cpk @ 6 sigma.
  • A patented wipe system design ensures enhanced wipe effectiveness for super fine aperture appli cations. Industry largest paper roll on Edison lasts more than one shift without the need of paper replenishment.
ITW MPM Momentum II HIE and Elite

ITW MPM – Semiconductor Assembly solution - Momentum II HiE & Elite

  • The Momentum II HiE (for High Efficiency) is a single-rail printer with servo motors, rather than stepper motors, driving the vision system’s X, Y, and Z axes. Faster than steppers, servos drive the vision gantry at higher speed and thus increase throughput and cut cycle time, making the Hi-E an efficient high volume printer.
  • The Momentum II Elite is the top-performer of the Momentum series, boasting the highest throughput and shortest cycle times of all. It is configured with a highly efficient triple track rail system featuring an input buffer, a central processing section, and an output buffer.
  • Momentum’s alignment repeatability is ±11 microns @ 6 sigma, Cpk ≥2. Its 6 sigma capability is designed in and independently verified. Wet print accuracy is ±17 microns @ 6 sigma, Cpk ≥2. Tighter performance tolerances mean higher repeatability with fewer defects.
ITW MPM Semiconductor Momentum II BTB

ITW MPM – Semiconductor Assembly solution - Momentum II BTB

  • Momentum® II BTB features a smaller footprint than the standard Momentum platform. Back-to-Back configuration allows dual lane processing for higher throughput without increasing line length or capital investment. Dual lane provides the flexibility to print multiple products in a single SMT line, such as top and bottom side, same side, or mother/ daughter boards making the BTB the most flexibile model in the proven Momentum platform.
  • With the MPM® Momentum® II BTB, you get all the accuracy and performance that the proven Momentum platform is known for. Most of the features and options available for Momentum series printers are available with the Momentum II BTB. MPM Momentum II BTB printers are offered in two different throughput configurations for optimum flexibility in line balancing.
  • MPM Momentum® II BTB printers feature the same ±11 micron alignment repeatability, with wet print accuracy of ±17 microns @ 6 sigma, Cpk ≥2.0, designed in and independently verified. MPM Momentum printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
ITW MPM Semiconductor Momentum II 100

ITW MPM – Semiconductor Assembly solution - Momentum II 100

  • The Momentum® II 100 delivers performance that one would expect to find only in higher-priced printing machines.
  • Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput demands grow.
  • Programmable and closed-loop squeegee systems ensure accurate and repeatable squeegee force with every print stroke; the system auto-compensates for squeegee deflection, and no force adjustment is needed for squeegee variations. For basic, repeatable printing quality with high yields and true affordability, the Momentum® II 100 has no equal.

ITW MPM Semiconductor Assembly Solutions

Semiconductor Assembly Solution
Semiconductor Assembly Solution
Semiconductor Assembly Solution